專利名稱

Bending die having surface microstructures and bending punch thereof(具表面微結構之彎形模具及其彎形沖頭)

申請號

US14190555

申請日

2014/2/26

專利證號

US09003858B1

專利權人

國立高雄科技大學

發明人

林栢村、郭峻志

主IPC分類碼

B21D 24/04(2006.01); B21D 22/02(2006.01); B21D 22/10(2006.01); B21D 35/00(2006.01)

專利摘要

Provided are a bending die having surface microstructures and a bending punch thereof applicable to stamping processing to bend a blank to form a shape. The bending die includes a lower die, an upper die, and a workpiece placing piece. The lower die includes a die, and the die includes a forming surface. The upper die includes a bending punch, the bending punch stamps a blank placed on the die in a back and forth stroke, and the bending punch includes a working portion coming into contact with the blank during stamping. The workpiece placing piece is disposed between the upper die and the lower die and used to position or/and press the blank placed on the die. A plurality of microstructures are disposed on the forming surface and/or on the surface of the working portion.